| |
Your Position£ºHome > Products |
|
| Product Center >> Adhesive industry >> a Used for sealing, potting with bonding of small electronic components such as relays, buzzers, sensors, protectors, etc. used in electronics with electrical industries |
|
| Category |
| One-component epoxy sealant
|
|
| Characteristics |
| Low curing temperature, fast curing speed, easy operation, low viscosity, good fluidity, high bonding strength, temperature resistance, excellent electrical property, good resistance to acid and alkali
|
|
| Scope of application |
| Used for sealing,potting and bonding of small electronic components such as relays, buzzers, sensors, protectors, etc. used in electronics and electrical industries
|
|
| Product performance |
7101-032 L
|
Properties
|
Test
Conditions
|
Unit
|
Index
|
|
Specific
gravity
|
25¡æ
|
g/cm3
|
1.35¡À0.03
|
|
Viscosity
|
25¡æ
|
mPa¡¤s
|
6000-10000
|
|
Curing conditions
|
-
|
-
|
90¡æ/120min
or 100¡æ/60min or 120¡æ/30min
|
|
Volume
resistance
|
-
|
¦¸¡¤m
|
¡Ý1.0¡Á1013
|
|
Electric
strength
|
-
|
MV/m
|
¡Ý20
|
|
Dielectric
constant
|
1MHz
|
-
|
4.1¡«4.7
|
|
Glass
transition temperature
|
DSC£¬10¡æ/Min
|
¡æ
|
¡Ý100
|
|
Hardness
|
Shore
D
|
25¡æ
|
¡Ý85
|
|
Shear
adhesive strength
|
Al-Al
|
MPa
|
¡Ý10.0
|
|
|
|
|
|
|
