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| Product Center >> Adhesive industry >> o.Used for sealing with bonding of metals, cores, plastics, etc. used in electronics with electrical industries |
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| Category |
| One-component epoxy adhesive
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| Characteristics |
| Moderate curing temperature,fast curing speed,easy operation,good toughness,good the temperature resistance, the bonding strength is high,excellent electrical properties, good resistance to acid and alkali, environmental product, moderate viscosity , the craft is good
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| Scope of application |
| Used for sealing and bonding of metals, cores, plastics, etc. used in electronics and electrical industries
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| Product performance |
7101-096B&7101-096G
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Properties
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Test
Conditions
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Unit
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Index
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Specific
gravity
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25¡æ
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g/cm3
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1.30¡À0.03
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Viscosity
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25¡æ,10RPM
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mPa¡¤s
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20000¡«40000
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Curing
conditions
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-
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-
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80¡æ/50-60min
or 100¡æ/20-30min
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Hardness
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25¡æ
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Shore
D
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80¡«90
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Shear
adhesive strength
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Al-Al
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MPa
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¡Ý15.0
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Volume
resistance
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Normal
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¦¸¡¤m
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¡Ý1.0¡Á1013
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Dielectric
constant
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1MHz£¬25¡æ
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-
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4.3¡«4.8
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Electric
strength
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Normal
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MV/m
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¡Ý20
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