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 Product Center >> Adhesive industry >> p.Sealing with coating of small electronic components can also be used for bonding of magnetic cores, coils, metal with engineering plastics electronic components
7101-J01
   Category
Epoxy resin adhesive
   Characteristics
Low viscosity, less precipitation, long storage period, good technology, high bonding strength, high resistance to high and low temperature impact
   Scope of application
Sealing and coating of small electronic components can also be used for bonding of magnetic cores, coils, metal and engineering plastics electronic components
   Product performance
                                                                                                                                                                  

Properties

Test Conditions

Unit

Index

Specific gravity

25¡æ

g/cm3

1.25¡«1.45

Viscosity

25¡æ

mPa¡¤s

5,000¡«20,000

Curing conditions

-

-

125¡æ/4h

 

Hardness

Shore D(25¡æ)

-

¡Ý 75

Glass transition temperature

TMA

¡æ

80¡«100

Inflecting strength

25¡æ

MPa

¡Ý 115

Inflecting modulus

25¡æ

MPa

3000¡«5000

Electric strength

25¡æ

MV/m

¡Ý 20

Volume resistance

25¡æ

M¦¸¡¤m

¡Ý 1¡Á106

Dielectric constant 30kHz)

25¡æ

-

3.5¡«5.5

Water absorption

100¡æ/1h

%

¡Ü 0.2

Shear adhesive strength

(AL/AL)

25¡æ

MPa

¡Ý 10

100¡æ

MPa

¡Ý 5

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